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WDS-700 BGA desoldering Rework Station for circuit boards repair Oscilloscope Output state memory function

4.3 SKU 33861362840

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Ships within 48 hours · Estimated delivery Sep 9 - Sep 14

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Description

Output state memory function

Intelligent SP001 Parameters:

Basic function: Brightness

PPD 120CXE Mini Intelligent Desoldering Rework Station for Remove Welding iPhone X CPU Repair

It comes brand new in factory sealed boxes

WDS-700 BGA desoldering Rework Station for circuit boards repair Oscilloscope Output state memory functionOptical alignment system BGA rework station WDS 700. WDS 700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after sales service and rework. How to separate BGA chip from motherboard How to replace a new BGA chip Repair steps : Separate the BGA chip from mother board we called desoldering Clean Pad Reballing or replace a new BGA chip directly

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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